8461.90.60.30/Precision Boule Flattening Planer/Japan

Precision Boule Flattening Planer from Japan

Machine tool that planes reference flats on semiconductor boules to indicate conductivity type and resistivity, critical for wafer identification. HTS 8461.90.60.30 covers this as planing equipment for cermet semiconductor materials per Chapter 84 notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include resistivity flat specification sheets matching statistical note requirements

• Prevent reclassification by distinguishing from wafer slicing saws (different function)