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8461.90.60.30/CNC Planing Machine for Semiconductor Wafer Preparation/Japan

CNC Planing Machine for Semiconductor Wafer Preparation from Japan

A precision CNC-controlled planing machine designed to plane the surface of semiconductor crystal boules or wafers to exact flatness tolerances required for subsequent fabrication processes. Classified under HTS 8461.90.60.30 as a planing machine working by removing metal or cermets (silicon being a metalloid processed similarly), specifically for high-precision semiconductor manufacturing applications. It features vacuum chucks and specialized tooling for handling fragile silicon substrates.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Verify machine specifications match statistical note definitions for semiconductor wafer preparation to avoid reclassification to Chapter 90 testing apparatus

• Provide detailed technical documentation proving planing function for metal/cermets removal, including boule grinding capabilities