8461.90.60.30/CNC Planing Machine for Semiconductor Wafer Preparation/Germany

CNC Planing Machine for Semiconductor Wafer Preparation from Germany

A precision CNC-controlled planing machine designed to plane the surface of semiconductor crystal boules or wafers to exact flatness tolerances required for subsequent fabrication processes. Classified under HTS 8461.90.60.30 as a planing machine working by removing metal or cermets (silicon being a metalloid processed similarly), specifically for high-precision semiconductor manufacturing applications. It features vacuum chucks and specialized tooling for handling fragile silicon substrates.

Duty Rate — Germany → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Verify machine specifications match statistical note definitions for semiconductor wafer preparation to avoid reclassification to Chapter 90 testing apparatus

• Provide detailed technical documentation proving planing function for metal/cermets removal, including boule grinding capabilities