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8461.90.60.30/CNC Planing Machine for Semiconductor Wafer Preparation/China

CNC Planing Machine for Semiconductor Wafer Preparation from China

A precision CNC-controlled planing machine designed to plane the surface of semiconductor crystal boules or wafers to exact flatness tolerances required for subsequent fabrication processes. Classified under HTS 8461.90.60.30 as a planing machine working by removing metal or cermets (silicon being a metalloid processed similarly), specifically for high-precision semiconductor manufacturing applications. It features vacuum chucks and specialized tooling for handling fragile silicon substrates.

Duty Rate — China → United States

41.9%

Rate breakdown

9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Verify machine specifications match statistical note definitions for semiconductor wafer preparation to avoid reclassification to Chapter 90 testing apparatus

• Provide detailed technical documentation proving planing function for metal/cermets removal, including boule grinding capabilities

CNC Planing Machine for Semiconductor Wafer Preparation from China — Import Duty Rate | HTS 8461.90.60.30