Wafer Slicing Diamond Saw from Japan
Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify diamond blade specs and wire tension controls; include wafer thickness tolerance proofs; avoid classifying as manual saw under consumer tools