Wafer Slicing Diamond Saw from Germany
Numerically controlled inner-diameter diamond saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss. Fits 8461.90.30.80 as NC sawing machine removing material for semiconductor wafer preparation per chapter notes. Ensures precise thickness for subsequent processing into devices.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify diamond blade specs and wire tension controls; include wafer thickness tolerance proofs; avoid classifying as manual saw under consumer tools