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8461.90.30.80/Semiconductor Wafer Lapper/Mexico

Semiconductor Wafer Lapper from Mexico

CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document flatness specs (e.g

• <1 micron); require cleanroom compatibility certification; common error: confusing with polishing under 8486

Semiconductor Wafer Lapper from Mexico — Import Duty Rate | HTS 8461.90.30.80