8461.90.30.80/Semiconductor Wafer Lapper/Canada

Semiconductor Wafer Lapper from Canada

CNC lapping machine that flattens and thins semiconductor wafers to exact tolerances by abrading with loose abrasive slurry, critical for flatness in fabrication. Classified 8461.90.30.80 for numerically controlled metal/cermet removal in wafer prep per statistical notes. Prepares wafer surface for photolithography.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document flatness specs (e.g

• <1 micron); require cleanroom compatibility certification; common error: confusing with polishing under 8486

Semiconductor Wafer Lapper from Canada — Import Duty Rate | HTS 8461.90.30.80