Double-Sided Wafer Polisher from Mexico
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry chemistry and pressure controls; BIS export license may apply; pitfall: undervaluing based on used equipment status