Double-Sided Wafer Polisher from Japan
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry chemistry and pressure controls; BIS export license may apply; pitfall: undervaluing based on used equipment status