8461.90.30.80/Double-Sided Wafer Polisher/Japan

Double-Sided Wafer Polisher from Japan

Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify slurry chemistry and pressure controls; BIS export license may apply; pitfall: undervaluing based on used equipment status