Double-Sided Wafer Polisher from Germany
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry chemistry and pressure controls; BIS export license may apply; pitfall: undervaluing based on used equipment status