Double-Sided Wafer Polisher from Canada
Numerically controlled double-sided polishing machine using chemical-mechanical planarization to achieve mirror-finish flatness on semiconductor wafers. HTS 8461.90.30.80 covers NC finishing tools removing cermet material per wafer processing notes. Vital for device fabrication yield.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify slurry chemistry and pressure controls; BIS export license may apply; pitfall: undervaluing based on used equipment status