8461.90.30.80/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

A CNC machine tool that grinds semiconductor crystal boules to precise diameters and flats indicating conductivity type and resistivity, as per statistical notes for wafer preparation. Under HTS 8461.90.30.80 as numerically controlled equipment working by removing cermet/semiconductor material. Essential for preparing boules before wafer slicing in chip fabrication.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide boule size specs and grinding tolerance data; ensure ITAR/EAR compliance for dual-use tech; pitfall: incorrect declaration as general grinder under 8460

Crystal Boule Grinder from Japan — Import Duty Rate | HTS 8461.90.30.80