8461.90.30.80/CNC Wafer Edge Profiling Grinder/Japan

CNC Wafer Edge Profiling Grinder from Japan

Numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. 8461.90.30.80 for NC grinding finishing semiconductor wafers per statistical notes. Improves yield by reducing edge defects.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify edge chip reduction metrics; cleanroom grade documentation; common error: classifying as general cylindrical grinder