</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.90.30.80/CNC Wafer Edge Profiling Grinder/Japan

CNC Wafer Edge Profiling Grinder from Japan

Numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. 8461.90.30.80 for NC grinding finishing semiconductor wafers per statistical notes. Improves yield by reducing edge defects.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Certify edge chip reduction metrics; cleanroom grade documentation; common error: classifying as general cylindrical grinder

CNC Wafer Edge Profiling Grinder from Japan — Import Duty Rate | HTS 8461.90.30.80