CNC Wafer Edge Profiling Grinder from Japan
Numerically controlled edge grinder that chamfers and profiles wafer edges to prevent chipping during handling and processing. 8461.90.30.80 for NC grinding finishing semiconductor wafers per statistical notes. Improves yield by reducing edge defects.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify edge chip reduction metrics; cleanroom grade documentation; common error: classifying as general cylindrical grinder