8461.90.30.80/CNC Shaping Machine for Wafer Carriers/Japan

CNC Shaping Machine for Wafer Carriers from Japan

Numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. 8461.90.30.80 for NC shaping by removing metal/cermet for semiconductor processing equipment parts. Maintains wafer integrity during handling.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify carrier dimensions and material (quartz/graphite); provide fab end-user verification; avoid parts classification under 8479