CNC Shaping Machine for Wafer Carriers from Japan
Numerically controlled shaping machine that forms custom profiles on semiconductor wafer carriers and boats for cleanroom transport. 8461.90.30.80 for NC shaping by removing metal/cermet for semiconductor processing equipment parts. Maintains wafer integrity during handling.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify carrier dimensions and material (quartz/graphite); provide fab end-user verification; avoid parts classification under 8479