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8461.90.30.80/CNC Broaching Machine for Wafer Chucks/Japan

CNC Broaching Machine for Wafer Chucks from Japan

Numerically controlled broaching tool that cuts precise keyways and slots in semiconductor wafer chucks for vacuum or electrostatic holding. 8461.90.30.80 for NC broaching removing cermet/metal in semiconductor context. Enables flat, distortion-free wafer processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include chuck material certs (e.g

• ceramic/metal); prove semiconductor end-use via buyer letters; pitfall: classifying as general broaching