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Rebuilt Wafer Edge Profiling Machine from Mexico

NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Edge geometry specs and chip-out prevention data

Diamond wheel rebuild documentation