Rebuilt Wafer Edge Profiling Machine from Japan
NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Edge geometry specs and chip-out prevention data
• Diamond wheel rebuild documentation