8461.90.30.60/Rebuilt Wafer Edge Profiling Machine/Japan

Rebuilt Wafer Edge Profiling Machine from Japan

NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Edge geometry specs and chip-out prevention data

• Diamond wheel rebuild documentation