Rebuilt Wafer Edge Profiling Machine from Canada
NC machine tool for profiling edges of semiconductor wafers post-polishing, removing excess material. HTS 8461.90.30.60 as used/rebuilt other NC metal/cermet removal tool. Prevents chipping during handling.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Edge geometry specs and chip-out prevention data
• Diamond wheel rebuild documentation