8461.90.30.60/Rebuilt Disco Wafer Polisher DGP-8735/Mexico

Rebuilt Disco Wafer Polisher DGP-8735 from Mexico

Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include polishing pad type and removal rate specifications

• SEMI M1 standards compliance mandatory for acceptance

• Chemical slurry residue requires proper cleaning certification

Rebuilt Disco Wafer Polisher DGP-8735 from Mexico — Import Duty Rate | HTS 8461.90.30.60