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Rebuilt Disco Wafer Polisher DGP-8735 from Mexico

Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Include polishing pad type and removal rate specifications

SEMI M1 standards compliance mandatory for acceptance

Chemical slurry residue requires proper cleaning certification