Rebuilt Disco Wafer Polisher DGP-8735 from Japan
Numerically controlled polishing machine rebuilt for final surface finishing of semiconductor wafers by controlled material removal. HTS 8461.90.30.60 for used NC polishers working on metal/cermets. Achieves mirror finish required for device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include polishing pad type and removal rate specifications
• SEMI M1 standards compliance mandatory for acceptance
• Chemical slurry residue requires proper cleaning certification