Wafer Edge Profiling Machine from Mexico
Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide edge chamfer specs (15-45° angles) and chip-out prevention test data
• Classify based on wafer size compatibility (200mm-450mm diameters)