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8461.50.80/Wafer Edge Profiling Machine/Mexico

Wafer Edge Profiling Machine from Mexico

Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide edge chamfer specs (15-45° angles) and chip-out prevention test data

• Classify based on wafer size compatibility (200mm-450mm diameters)