8461.50.80/Wafer Edge Profiling Machine/Japan

Wafer Edge Profiling Machine from Japan

Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide edge chamfer specs (15-45° angles) and chip-out prevention test data

• Classify based on wafer size compatibility (200mm-450mm diameters)