8461.50.80/Wafer Edge Profiling Machine/Japan

Wafer Edge Profiling Machine from Japan

Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide edge chamfer specs (15-45° angles) and chip-out prevention test data

• Classify based on wafer size compatibility (200mm-450mm diameters)

Wafer Edge Profiling Machine from Japan — Import Duty Rate | HTS 8461.50.80