Wafer Edge Profiling Machine from Canada
Precision cutting-off machine that profiles wafer edges to prevent chipping during handling in semiconductor fabs. Classified under HTS 8461.50.80 for specialized semiconductor wafer preparation sawing equipment.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide edge chamfer specs (15-45° angles) and chip-out prevention test data
• Classify based on wafer size compatibility (200mm-450mm diameters)