Silicon Ingot Notching Machine from Mexico
Automated cutting machine that creates orientation flats on silicon ingots for wafer alignment in semiconductor processing. Falls under HTS 8461.50.80 as specialized cutting-off equipment for semiconductor boule preparation.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify notch geometry (primary/secondary flats per SEMI M1 standards)
• Provide ingot diameter range (150-450mm) documentation