8461.50.80/Silicon Ingot Notching Machine/Japan

Silicon Ingot Notching Machine from Japan

Automated cutting machine that creates orientation flats on silicon ingots for wafer alignment in semiconductor processing. Falls under HTS 8461.50.80 as specialized cutting-off equipment for semiconductor boule preparation.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify notch geometry (primary/secondary flats per SEMI M1 standards)

• Provide ingot diameter range (150-450mm) documentation