8461.50.80/Silicon Ingot Notching Machine/Japan

Silicon Ingot Notching Machine from Japan

Automated cutting machine that creates orientation flats on silicon ingots for wafer alignment in semiconductor processing. Falls under HTS 8461.50.80 as specialized cutting-off equipment for semiconductor boule preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Specify notch geometry (primary/secondary flats per SEMI M1 standards)

• Provide ingot diameter range (150-450mm) documentation