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8461.50.80/Silicon Ingot Notching Machine/Germany

Silicon Ingot Notching Machine from Germany

Automated cutting machine that creates orientation flats on silicon ingots for wafer alignment in semiconductor processing. Falls under HTS 8461.50.80 as specialized cutting-off equipment for semiconductor boule preparation.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify notch geometry (primary/secondary flats per SEMI M1 standards)

• Provide ingot diameter range (150-450mm) documentation

Silicon Ingot Notching Machine from Germany — Import Duty Rate | HTS 8461.50.80