Semiconductor Wafer Slicing Saw from Japan
High-precision diamond wire saw for slicing ultra-thin wafers from monocrystalline silicon boules in semiconductor fabrication. Classified in HTS 8461.50.80 as a sawing machine specifically for cutting-off semiconductor material to wafer thickness tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document wire diameter (<50μm) and kerf loss specs (<20μm) to prove semiconductor precision
• Obtain supplier certification linking machine to statistical note (b)(ii)(B) wafer slicing