Semiconductor Wafer Slicing Saw from Germany
High-precision diamond wire saw for slicing ultra-thin wafers from monocrystalline silicon boules in semiconductor fabrication. Classified in HTS 8461.50.80 as a sawing machine specifically for cutting-off semiconductor material to wafer thickness tolerances.
Duty Rate — Germany → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wire diameter (<50μm) and kerf loss specs (<20μm) to prove semiconductor precision
• Obtain supplier certification linking machine to statistical note (b)(ii)(B) wafer slicing