Semiconductor Wafer Slicing Saw from Canada
High-precision diamond wire saw for slicing ultra-thin wafers from monocrystalline silicon boules in semiconductor fabrication. Classified in HTS 8461.50.80 as a sawing machine specifically for cutting-off semiconductor material to wafer thickness tolerances.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document wire diameter (<50μm) and kerf loss specs (<20μm) to prove semiconductor precision
• Obtain supplier certification linking machine to statistical note (b)(ii)(B) wafer slicing