8461.50.80/Gallium Arsenide Wafer Saw/Japan

Gallium Arsenide Wafer Saw from Japan

Specialized inner-diameter saw optimized for brittle GaAs compound semiconductor wafers, minimizing subsurface damage. HTS 8461.50.80 includes sawing machines for non-silicon semiconductor materials per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document material compatibility (GaAs, InP) and subsurface damage specs (<1μm)

• Include laser marking or alignment system details for classification