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8461.50.80/Gallium Arsenide Wafer Saw/Canada

Gallium Arsenide Wafer Saw from Canada

Specialized inner-diameter saw optimized for brittle GaAs compound semiconductor wafers, minimizing subsurface damage. HTS 8461.50.80 includes sawing machines for non-silicon semiconductor materials per statistical notes.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Document material compatibility (GaAs, InP) and subsurface damage specs (<1μm)

• Include laser marking or alignment system details for classification