Float Zone Crystal Grower from Japan
Specialized sawing and cutting machine employing float zone method to produce high-purity silicon crystals for wafers, involving precise zone melting and cutting-off operations. Falls under HTS 8461.50.80 for semiconductor-specific cutting-off machines working by removing cermets or similar materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include process flow diagrams showing float zone melting and cutting sequences in import documentation
• Label as semiconductor equipment to distinguish from general purpose zone refiners