Float Zone Crystal Grower from Japan
Specialized sawing and cutting machine employing float zone method to produce high-purity silicon crystals for wafers, involving precise zone melting and cutting-off operations. Falls under HTS 8461.50.80 for semiconductor-specific cutting-off machines working by removing cermets or similar materials.
Duty Rate — Japan → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include process flow diagrams showing float zone melting and cutting sequences in import documentation
• Label as semiconductor equipment to distinguish from general purpose zone refiners