Diamond Wire Wafer Slicer from Mexico
Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. HTS 8461.50.80 covers this high-precision sawing technology for semiconductor wafer manufacturing.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Document wire spacing accuracy (<2μm) and squareness tolerances
• Include slurry management system specs for classification as complete machine