Diamond Wire Wafer Slicer from Germany
Advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. HTS 8461.50.80 covers this high-precision sawing technology for semiconductor wafer manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document wire spacing accuracy (<2μm) and squareness tolerances
• Include slurry management system specs for classification as complete machine