Czochralski Crystal Puller from Japan
A machine tool used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon using the Czochralski method. It removes excess material through precise cutting and grinding processes to achieve required dimensions, classified under HTS 8461.50.80 as a sawing or cutting-off machine for semiconductor wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify equipment qualifies under statistical notes for semiconductor processing to ensure correct classification
• Provide detailed technical specs and end-use certification to avoid misclassification as general metalworking machinery