Czochralski Crystal Puller from Germany
A machine tool used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon using the Czochralski method. It removes excess material through precise cutting and grinding processes to achieve required dimensions, classified under HTS 8461.50.80 as a sawing or cutting-off machine for semiconductor wafer production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Verify equipment qualifies under statistical notes for semiconductor processing to ensure correct classification
• Provide detailed technical specs and end-use certification to avoid misclassification as general metalworking machinery