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8461.50.40/ZAX Wafer Edge Profiling Saw/Mexico

ZAX Wafer Edge Profiling Saw from Mexico

Numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. Essential for semiconductor wafer preparation, HTS 8461.50.40.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify edge tolerance specs in import docs