ZAX Wafer Edge Profiling Saw from Japan
Numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. Essential for semiconductor wafer preparation, HTS 8461.50.40.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge tolerance specs in import docs