ZAX Wafer Edge Profiling Saw from Germany
Numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. Essential for semiconductor wafer preparation, HTS 8461.50.40.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge tolerance specs in import docs