Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Mexico
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include accuracy specs (micron-level) to justify machine tool status
• Avoid 'tester' language to stay out of Chapter 90
• Certify cleanroom compatibility for semi-use validation