Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Mexico
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Include accuracy specs (micron-level) to justify machine tool status
• Avoid 'tester' language to stay out of Chapter 90
• Certify cleanroom compatibility for semi-use validation