Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Japan
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include accuracy specs (micron-level) to justify machine tool status
• Avoid 'tester' language to stay out of Chapter 90
• Certify cleanroom compatibility for semi-use validation