Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System from Canada
CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. Removes metal/cermet via abrasive wheel, classified under HTS 8461.50.40 for numerically controlled sawing operations.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include accuracy specs (micron-level) to justify machine tool status
• Avoid 'tester' language to stay out of Chapter 90
• Certify cleanroom compatibility for semi-use validation