Sylatronix STX 220 Wafer Dicing Saw from Mexico
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare multi-lane capacity in technical data sheet
• Separate software from hardware in valuation if applicable
• Watch for anti-dumping on Asian-origin saws