Sylatronix STX 220 Wafer Dicing Saw from Japan
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Declare multi-lane capacity in technical data sheet
• Separate software from hardware in valuation if applicable
• Watch for anti-dumping on Asian-origin saws