Sylatronix STX 220 Wafer Dicing Saw from Germany
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Declare multi-lane capacity in technical data sheet
• Separate software from hardware in valuation if applicable
• Watch for anti-dumping on Asian-origin saws