Sylatronix STX 220 Wafer Dicing Saw from China
Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Declare multi-lane capacity in technical data sheet
• Separate software from hardware in valuation if applicable
• Watch for anti-dumping on Asian-origin saws