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8461.50.40/Sylatronix STX 220 Wafer Dicing Saw/Canada

Sylatronix STX 220 Wafer Dicing Saw from Canada

Numerically controlled gang saw for simultaneous cutting-off multiple semiconductor wafer lanes. Designed for high-volume cermet material removal in device singulation, under HTS 8461.50.40.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Declare multi-lane capacity in technical data sheet

• Separate software from hardware in valuation if applicable

• Watch for anti-dumping on Asian-origin saws

Sylatronix STX 220 Wafer Dicing Saw from Canada — Import Duty Rate | HTS 8461.50.40