Mazak Optonics HCG-4020 CNC Laser Cutting Machine from Mexico
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Verify CNC control certification and include technical specs in entry docs to confirm numerical control under 8461.50.40
• Provide evidence of metal/cermet removal capability; misclassification as non-CNC risks penalties
• Include end-use statement for semiconductor fab to avoid reclassification to Chapter 84 parts