Mazak Optonics HCG-4020 CNC Laser Cutting Machine from Japan
A numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules in semiconductor manufacturing. It removes material using a focused laser beam on silicon or gallium arsenide, fitting under HTS 8461.50.40 as a numerically controlled sawing or cutting-off machine working by removing metal or cermets.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify CNC control certification and include technical specs in entry docs to confirm numerical control under 8461.50.40
• Provide evidence of metal/cermet removal capability; misclassification as non-CNC risks penalties
• Include end-use statement for semiconductor fab to avoid reclassification to Chapter 84 parts